Ukuhlolwa koMbono woMatshini Isisombululo esipheleleyo se-3.5” SBC kunye neeProsesa ze-Intel Core ze-12th/13th Gen
1. Ukubekwa kwesisombululo
Isebenzisa amandla ehardware yebhodi kuquka ii-ports ze-4 ze-Gigabit LAN, ii-interfaces ze-4×USB3.2 ezikhawulezayo, ukusebenza okunamandla kwekhompyutha ye-12th/13th Gen Intel Core CPUs, ukuya kuthi ga kwi-32GB DDR5 large memory, iziphumo zokubonisa ezizimeleyo ezimbini, ulawulo lwe-COM/GPIO olunemijelo emininzi kunye nokufakwa kwamandla e-wide-voltage, le khompyutha yebhodi enye isebenza njenge-core computing host yezixhobo zokubona ngokupheleleyo komatshini. Igubungela umsebenzi opheleleyo wokufumana imifanekiso, ukuqatshelwa kwe-algorithm, ukugweba ngengqiqo kunye nemveliso yokudibanisa izixhobo, ixhasa ukuhlolwa komgangatho okungayekiyo iiyure ezingama-24 ngosuku kwimigca yemveliso.
Imizekelo yeSicelo esiQhelekileyo
Ukuhlolwa kwe-AOI yecandelo le-elektroniki, ukulinganiswa kobukhulu beendawo ezichanekileyo, ukufunyanwa kweziphene zomphezulu, ukuqatshelwa kwekhowudi yebhakhowudi kunye ne-QR, ukuhlolwa kobunyani bokupakisha, ukuhlelwa kwezinto ezisekelwe embonweni.
2. Uluhlu olupheleleyo loCwangciso lweHardware
2.1 Umphathi oyintloko (3.5” Ikhompyutha yeBhodi enye yoShishino)
- I-CPU: i5-1335U / i7-1355U
Iimodeli ze-multi-core high-turbo zikhethwa kakhulu kwiiprojekthi zombono ukuze zinike amandla okusebenza kakuhle kwemifanekiso ehambelanayo. - Imemori: Isithuba se-SO-DIMM se-16GB / 32GB DDR5 4800MHz, esibalulekileyo ekugcinweni kwemifanekiso ecacileyo evela kwiikhamera ezininzi.
- Indawo yokugcina: I-M.2 NVMe SSD enesantya esiphezulu sokufunda/ukubhala sokugcina iisampulu zemifanekiso, iilog zokuhlola kunye nee-algorithms zenkqubo.
- Ukusasazwa kobushushu: I-heatsink eqinisiweyo eyenzelwe wena ifumaneka ukwakha izivalo ezivaliweyo ezingenafeni, ezimelana nothuli kwaye ezimelana nokufuma kwiindawo zokusebenzela ezinothuli.
- Ubonelelo ngoMbane: Iyahambelana namandla e-DC e-12V/24V yasefektri; Ukufakwa kwe-DC okubanzi kwe-9~36V kuthintela ukuqhekeka kwenkqubo okubangelwa kukuguquguquka kwevolthi kunye nokunyuka okukhulu kwesantya sokuqalisa.
2.2 Izixhobo zokufumana imifanekiso (ii-interfaces zebhodi ehambelanayo)
Ukhetho A: Iikhamera zeGigE Industrial (Zicetyiswayo xa kuhlolwa iikhamera ezininzi)
Ibhodi idibanisa amazibuko e-Ethernet e-4×RJ45 Gigabit, anokuqhagamshela ngqo kwiikhamera ze-4 GigE. Izibuko ngalinye lisebenza ngokuzimeleyo ngaphandle kwempikiswano ye-bandwidth, liqinisekisa ukulahleka kwesakhelo kunye nokubambezeleka kokudluliselwa okuphantsi kakhulu. Izixhobo ezihambelanayo: imithombo yokukhanya yemizi-mveliso, iilensi, abalawuli bokukhanya.
Ukhetho B: Iikhamera ze-USB3.2 zoshishino / Iikhamera zobunzulu be-3D
Iiports ezine zesantya esiphezulu ze-USB3.2 ezifakwe ngasemva zibonelela nge-bandwidth eyaneleyo yetshaneli enye ukuqhagamshela iikhamera ze-USB global shutter kunye nezikena zeprofayili ye-laser ye-3D ukuze kulinganiswe ngomlinganiselo ochanekileyo.
2.3 Isiphumo somboniso
- I-LVDS / i-eDP ekwi-Intanethi: Qhagamshela kwizikrini zokuchukumisa zasekuhlaleni ukuze abaqhubi bakwazi ukulungisa iiparameter kunye nokubona kwangaphambili imifanekiso ethathwe kwindawo.
- Isiboniso esizimeleyo esiphindwe kabini nge-HDMI + DP: Ixhasa isiboniso esahlukileyo sesikrini esiqhekekileyo. Esinye isikrini sibonisa imifanekiso yekhamera ngexesha langempela, ngelixa esinye sibonisa iingxelo zokuhlolwa kunye nezibalo zemveliso ye-NG.
2.4 Ulawulo loNxibelelwano oluPhakathi (I/O yangaphakathi ekwiBhodi)
- Iiports ze-serial ze-4×COM: Qhagamshela abalawuli bokukhanya, ii-servo motors, amaqonga okufuduka kunye nabafundi beebhakhowudi.
- Igalelo ledijithali le-GPIO kunye nesiphumo:DI: Fumana imiqondiso yokuqalisa evela kwiisensa ze-photoelectric xa izinto zokusebenza zifika ukuze zithathwe iifoto.
- Iiports ze-USB2.0 zangaphakathi ze-4 ×: Qhagamshela iiswitshi zeenyawo, izikena zebhakhowudi kunye nabafundi bekhadi elincinci.
2.5 Ukwandiswa Okungenazingcingo (Isithuba seMini PCIe)
Iimodyuli ze-4G / Wi-Fi ezikhethwayo zivumela ukulayisha idatha yokuhlolwa ngexesha langempela kunye nemifanekiso engalunganga kwiinkqubo ze-MES zefektri okanye kumaqonga efu ukuze kujongwe imveliso ekude.
3. Uhambo olupheleleyo lokusebenza
- Njengoko izinto zokusebenza zihamba kumgca wemveliso, izinzwa ze-photoelectric zithumela imiqondiso ye-trigger kwi-GPIO input, kwaye i-mainboard ikhupha imiyalelo yokubamba.
- Iikhamera ezininzi zeGigE / USB3.2 zibamba imifanekiso ekumgangatho ophezulu ngaxeshanye, ethunyelwa ngesantya esiphezulu kwaye igcinwe kwimemori yebhodi ephambili.
- I-CPU ye-12th/13th Gen Intel Core kunye nemizobo edibeneyo isebenzisa ii-algorithms zombono ngaxeshanye ukwenza ukufunyanwa kweziphene, ukulinganiswa kobukhulu, ukuqatshelwa koonobumba kunye nokuqinisekiswa kobukho.
- Le nkqubo izihlela ngokuzenzekelayo iindawo zokusebenza njenge-OK okanye i-NG:
- Iimveliso ezifanelekile ze-OK: I-GPIO ikhupha imiqondiso, kwaye yonke idatha efanelekileyo igcinwa kwi-SSD yendawo.
- Iimveliso ezineziphene ze-NG: Zivuse ii-alamu ezivakalayo nezibonakalayo, ziqhube ii-cylinders ukuze zingawamkeli ama-workpieces, kwaye zigcine imifanekiso eneziphene ngaxeshanye.
- Iingxelo zevidiyo zexesha langempela kunye neengxelo zezibalo ziboniswa kwizikrini ezimbini ngaxeshanye.
- Iirekhodi zohlolo zingalayishwa ngokuzithandela kwinkqubo ye-MES yomzi-mveliso nge-4G / Wi-Fi ukuze kulandelelwe idatha epheleleyo kunye nohlalutyo lomthamo.
4. Iingenelo eziphambili zale Bhodi kwiMbono yoMshini
Ukufunyanwa okunamandla kweekhamera ezininzi ngaxeshanye
Ixhotyiswe ngamazibuko amane azimeleyo e-Gigabit LAN kunye namazibuko amane e-USB3.2 okufumana imifanekiso emibini, exhasa ukuya kuthi ga kwiikhamera ezisi-8 ezisebenza ngaxeshanye ukuze kuhlolwe ngaxeshanye izitishi ezininzi. Akukho makhadi ongezelelweyo okwandisa inethiwekhi afunekayo, nto leyo eyenza kube lula ulwakhiwo lomatshini ngokubanzi.
Amandla okuBala kunye neMemori eyaneleyo yee-Algorithms ezintsonkothileyo
Uyilo lwe-hybrid multi-core lweeprosesa ze-13th Gen i5/i7 ezidityaniswe nememori enkulu ukuya kuthi ga kwi-32GB zinokugcina imifanekiso emikhulu enesisombululo esiphezulu. Isebenzisa isoftware yombono oqhelekileyo kuquka iHalcon, i-OpenCV kunye neVisionPro kakuhle, kwaye ixhasa ukufunda okunzulu okukhaphukhaphu kokuhlelwa kweziphene.
Iziboniso Ezimbini Ezizimeleyo Zenza Ukulungiswa Kweengxaki Kwindawo
Abaqhubi banokujonga imifanekiso engafakwanga kwisikrini esinye ngelixa belungisa imida yokuhlolwa kwaye behlola iisampulu zembali ezineziphene kwelinye, nto leyo ephucula kakhulu ukusebenza kakuhle kokulungisa iimpazamo.
Ulawulo lwe-I/O lweMveliso yoBuchule oluSebenzayo oluQhelekileyo
Iiports ezidibeneyo ze-serial kunye ne-GPIO zenza ukubanjwa komfanekiso wekhamera, ulawulo lweqonga lokuhamba kunye nokusebenza kokuhlelwa ngebhodi enye. Akukho PLC eyongezelelweyo ifunekayo, inciphisa iindleko zehardware kunye nobunzima bokufakelwa kweentambo.
Ukuziqhelanisa Okuphezulu Neemeko Ezinzima Zemizi-mveliso
Ukufakwa kwamandla okubanzi kwe-9~36V kunye nokupholisa okungenafeni okukhethwayo kunye neendawo ezivaliweyo ezingangeni luthuli zilungele iiworkshop ezinothuli ezifana nemigca yokugquma, izityalo zokudibanisa izixhobo ze-elektroniki kunye neendawo zokusebenzela zokucubungula isinyithi. I-compact 3.5” form factor ingafakwa ngqo kwiirakhi zezixhobo ukuze kongiwe indawo yokufaka.
Ugcino Olukhulu kunye nokuFumaneka kwedatha ekude
I-SSD yesantya esiphezulu ye-M.2 ibonelela ngogcino olukhulu lwemifanekiso enesiphene esikhulu; Iimodyuli ezingenazingcingo ze-Mini PCIe ziqhagamshela kumaqonga efu emveliso ukuze kufezekiswe ulawulo lwedijithali lwedatha epheleleyo yemveliso.
5. Iimeko zeSicelo seShishini eziHlanganisiweyo
1. Uhlolo lwe-AOI lwe-3C Electronics
Fumana iziphene zamalungu e-solder e-PCB, i-chip offset, imikrwelo yendlu kunye nezihlanganisi ezingekhoyo; iikhamera ezininzi ziskena amacala omabini eebhodi zesekethe ngaxeshanye.
2. Ukulinganiswa koBume beZixhobo zeHardware kunye nokuQonda
Hlola ubungakanani bomda, umgangatho we-chamfer kunye nobukho be-burr yezikrufu, iibheringi kunye neendawo ezifakwe isitampu; Iikhamera ze-3D USB zisetyenziselwa ukulinganisa umahluko wobude.
3. Ukuhlolwa koMphezulu wokuPakisha ukutya
Jonga ukuthembeka kwesitywina sokupakisha, ukufundeka komhla wokuveliswa okushicilelweyo kunye nongcoliseko lwezinto zangaphandle.
4. Umbono Wokuhlela Izinto Ezifunekayo
Funda iikhowudi ze-QR kwiipakethe zokuhambisa, fumana iipakethe ezonakeleyo kwaye uhlele iisilinda ukuze utshintshe iipakethe ngokuzenzekelayo.
5. Ukuhlolwa kweNkangeleko kwiLithium New Energy Industry
Iziphene zesikrini kwiziqwenga zeepali zebhetri, iindawo eziqhekekileyo kunye nemithungo yeglue engalinganiyo.
Ixesha leposi: Meyi-17-2026
